DOWA HOLDINGS CO., LTD.

Electronic Materials

Electronic Materials

Electronic Materials

For cutting-edge electronic devices, we offer distinctive semiconductor materials, conductive materials, and magnetic materials using technologies such as ultra-purification, single crystal and thin film growth, and particle synthesis.

Core Technologies

Crystallization Technology

  • High-Purity and Analytical Technology
    • We have a variety of high-purification technologies of 6N (99.9999%) or more, as well as analytical technologies that can handle impurities on the order of ppb.
  • Single Crystal Growth
    • We have low-defect single crystal growth technology by controlling composition and temperature.
    • We have wafer surface purification, flatness and surface treatment technology.
    • We have the technology to increase the diameter of wafers.
  • Single Crystal Thin Film Growth
    • We have a variety of III-V compound semiconductor thin film growth technologies.
    • Optimal design achieves both optical characteristics and low electrical resistance.
    • We have the technology to grow a uniform single crystal thin film by controlling the composition and temperature.
  • Semiconductor Design & Manufacturing Technology
    • We have built an integrated system from raw materials to high-purity metals, single crystal substrates, epitaxial substrates, and devices.
    • Optimal design achieves both optical characteristics and low electrical resistance.
    • We use MES (Manufacturing Execution System) for process management.
  • Evaluation and Analysis Technology
    • We have epitaxial substrate evaluation technology and automatic device inspection technology (electro-optical characteristics and appearance).

Powder Control Technology

  • Wet Synthesis
    We have the following synthesis technologies for magnetic powders, metal powders (Ag, Cu, alloys), and oxide powders.
    • Particle size can be controlled from several nanometers to several micrometers.
    • Particle shape can be controlled into spherical, needle, flake, etc.
    • Particle size distribution and metal composition can be controlled.
  • Dry Synthesis
    We have the following synthesis technologies for magnetic powders, metal powders (Ag, Cu, alloys), and oxide powders.
    • Particle size can be controlled from submicron to several tens of micrometers.
    • Particle size distribution and metal composition can be controlled.
  • Powder Processing
    We have the following powder processing technologies for magnetic powders, metal powders (Ag, Cu, alloys), and oxide powders.
    • Shape control technology (flakes)
    • Particle size distribution control technology by advanced classification
    • Crystal structure control technology by firing
  • Surface Control
    We have the following surface control technologies for magnetic powders, metal powders (Ag, Cu, alloys), and oxide powders.
    • Conductive material coating
    • Non-magnetic layer coating
    • Withstand voltage coating
  • Conductivity Control
    Wet synthesis, dry synthesis, powder processing, and surface control can provide the following conductive materials to meet your needs:
    • Chemically reduced Cu powder
    • Atomized Cu powder,　Atomized Ag powder
    • Flake-type Cu powder
    • Nano-size Ag powder
    • Oxide coated active material powder
  • Magnetic Control
    Wet synthesis, dry synthesis, powder processing, and surface control can provide you with the following magnetic materials to meet your needs:
    • Ferrite powder, carrier powder
    • Silica coated soft magnetic powder
  • Mass Production Design
    • We have scale-up technology that covers from research to mass production.
    • We own facilities capable of supplying products up to several hundred tons per month.

Examples of Core Technology Applications

  • High-Purity Technology and Analytical Technology
    Manufacturing Flow (example)
    Features of Technology (Our Strengths)
    • By making full use of a variety of purification technologies (crystal purification, electrolytic purification, distillation purification, vacuum purification), it is possible to achieve high purity of 99.9999% or more.
    • We have advanced impurity analysis technology that enables impurity analysis on the order of ppb.
    High-Purity Metal
  • Single Crystal Growth Technology
    Manufacturing Flow (example)
    Features of Technology (Our Strengths)
    • We have a variety of crystal growth technologies such as the LEC method and the VGF method.
    • Highly accurate carrier density control is possible.
    • Single crystals with low EPD (Etch pit density) can be obtained.
    GaAs Single Crystal Substrate
  • Thin-Film Single Crystal Growth Technology
    Manufacturing Flow (example)
    Features of Technology (Our Strengths)
    • We have high-quality III-V group compound semiconductor thin film (AlGaIn-AsPSb, AlGaIn-N) growth technology using LPE method and MOCVD method.
    • We have high-precision impurity concentration control technology and film thickness control technology.
    • Compatible with a wide variety of substrate sizes
    • We own evaluation equipment such as PL (Photoluminescence) equipment, XRD equipment, ECV equipment, Hall effect measurement equipment, non-contact sheet resistance measurement equipment, wafer surface inspection equipment, AFM (Atomic Force Microscopy), SEM and other evaluation equipment.
    Epitaxial Substrate
  • Semiconductor Design and Manufacturing Technology
    Manufacturing Flow (example)
    Features of Technology (Our Strengths)
    • We have LED high-output technology by surface treatment.
    • We have technology to improve the optical characteristics of LEDs by forming optimal electrodes and reduce resistance.
    • LED output, wavelength, and shape can be customized.
    • We have technology to automatically inspect electro-optical properties and appearance.
    LED
    Photodiode
  • Powder Processing Technology    Wet Manufacturing
    Manufacturing Flow (example)
    • Magnetic Powder (FeCo)
    • Conductive Powder (Copper
      Powder 1.5 micrometers)
    • Conductive Powder (Copper
      Powder 3.0 micrometers)
    Features of Technology (Our Strengths)
    • There are technologies to control nucleation and growth in wet particle synthesis.
    • We can be possible to control the particle size, shape, particle size distribution, composition, and surface of nano- and micron-sized powders.
  • Powder Processing Technology Dry Manufacturing
    Manufacturing Flow (example)
    • Atomized Copper Powder
    • Atomized Silver Powder
    • Gas Atomized Metal Powder
    Features of Technology (Our Strengths)
    • We can provide various kinds of metals (copper, silver) and alloy powders.
    • Composition and particle size can be controlled from submicron to several tens of microns.
  • Powder Processing Technology: Flakes, Surface Treatment
    Manufacturing Flow (example)
    • Atomized Flakes Copper Powder
    • Silver Coated Copper Powder
    • SiO2 Coated Soft Magnetic Powder
    • Oxide Coated Active Material Powder
    Features of Technology (Our Strengths)
    • We can control the shape and surface of particles.
    • We can provide silver-coated copper powder as an alternative to silver.
    • We offer SiO2 coated soft magnetic powder with surface treatment (SiO2 coating) for high heat resistance and insulation.
    • We are improving the conductivity and durability of active material powder for use as rechargeable battery materials.