| Spec Item |
Dimensions |
Cu-AlN
Standerd
(AMB)*1 |
Cu-AlN
3Steps
(AMB) |
Al-AlN
ALMIC®
(Molten-Al-direct-bonding method) |
| Ceramics |
— |
AlN |
AlN |
AlN |
| Mechanical Properties |
|
|
|
|
| Bending Strength |
Initial |
MPa |
500 |
500 |
650 |
| After Heating |
400 |
400 |
620 |
| Bending Quantity |
Initial |
mm |
0.27 |
0.28 |
0.45 |
| After Heating |
0.22 |
0.22 |
0.35 |
| Ceramic Bending Strength |
MPa |
500 |
500 |
500 |
| Peeling Strength |
N/cm |
＞150 |
＞150 |
＞300 |
| Wire Bonding Strength |
g |
＞550 |
＞550 |
＞550 |
| Thermal Properties |
|
|
|
|
| Thermal Conductivity (at RT) |
W/(m·K) |
≧170 |
≧170 |
≧170 |
| Thermal Cycle at (-40°C/125°C) |
cycles |
＞200 |
＞1,000 |
＞3,000 |
| Electrical Properties |
|
|
|
|
| Dielectric Strength (in insulating oil) |
kV/mm |
＞11 |
＞11 |
＞11 |
| Volume Resistivity at RT |
Ω·cm |
＞1×1012 |
＞1×1012 |
＞1×1012 |
| Other Specification |
|
|
|
|
| Ceramic Max. Size |
mm |
95×80 |
95×80 |
80×80 |
| Ceramic Thickness |
mm |
0.38 · 0.635 · 0.8 · 1.0 |
0.635 · 0.8 · 1.0 |
0.635 · 0.8 · 1.0 |
| Metal Thickness (Pattem/Heat sink) |
mm |
0.15 · 0.2 · 0.25 · 0.3 |
0.15 · 0.2 · 0.25 · 0.3 |
0.4/0.2–0.4 |
| Min. Pattern Width |
mm |
1.0 |
1.5 |
1.0 |
| Min. Pattern Space |
mm |
1.0 |
1.0 |
0.8 |
| Tolerance Pattern/Pattern |
mm |
≦±0.25 |
≦±0.25 |
≦±0.30 |
| Surface Roughness (Rz) |
μm |
＜7 |
＜7 |
＜15
|
| Camber |
mm |
≦0.1/50mm |
≦0.1/50mm |
≦0.1/50mm |
| Ni Plating Thickness |
μm |
2–6 |
2–6 |
2–6 |
| Solderability |
(%) |
≧95 |
≧95 |
≧95 |
| *1. AMB: Active Metal Brazing Method |
The figures in the table are representative values and are not guaranteed values. |
