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Metal Substrates
 
 Metal Substrates
 
■ DOWA Metal Substrate Standard Spec.
Spec Item Dimensions Cu-Al2O3
(CBC)*1
Cu-AlN
Standerd
(AMB)*2
Cu-AlN
3Steps
(AMB)
Al-AlN
ALMIC
(MCB)*3
Ceramics Al2O3 AlN AlN AlN
Mechanical Properties          
Bending Strength Initial MPa 450 500 500 650
After heating 220 400 400 620
Bending quantity Initial mm 0.23 0.27 0.28 0.45
After heating 0.12 0.22 0.22 0.35
Ceramic bending strength MPa 430 500 500 500
Peeling strength N/cm >100 >150 >150 >300
Wire bonding strength g >550 >550 >550 >550
Thermal Properties          
Thermal conductivity (at RT) W/(m·K) >20 >170 >170 >170
Thermal shock at (-40°C/125°C) cycles >30 >300 >1,000 >3,000
Electrical Properties          
Dielectric strength (in insulating oil) kV/mm >11 >11 >11 >11
Volume resistivity at RT Ω·cm >1×1012 >1×1012 >1×1012 >1×1012
Other Specification          
Ceramic max size mm 110×100 95×80 95×80 80×80
Ceramic thickness mm 0.635 (0.25 · 0.32 · 0.38) 0.635 · 1.0 0.635 · 1.0 0.635 · 1.0
Metal thickness (Pattem/heat sink) mm 0.3 · 0.25 · 0.20 0.3 · 0.25 · 0.20 · 0.15 0.3 · 0.25 · 0.20 · 0.15 0.4/0.2–0.4
Min. pattern width mm 1.0 1.0 1.5 1.0
Min. pattern space mm 1.0 1.0 1.0 0.8
Tolerance pattern/Pattern mm ≦±0.25 ≦±0.25 ≦±0.25 ≦±0.30
Surface roughness (Rz) μm <7 <7 <7 <15
Camber mm ≦0.1/50mm ≦0.1/50mm ≦0.1/50mm ≦0.1/50mm
Ni plating thickness μm 2–6 2–6 2–6 2–6
Solderability (%) ≧95 ≧95 ≧95 ≧95
*1. CBC : Copper Bonding Ceramic
*2. AMB : Active Metal Brazing Method
*3. MCB : Metal Casting Direct Bonding Method
These data is subject to revision without prior notification.
 
     
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